1.Application of diamond in AI chips, optical modules and other fields:
There are two main product forms of diamond used as heat dissipation materials: CVD diamond and copper-diamond composite material.
2.Comparison of performance, cost and industrialization prospect between diamond and graphene for high-end AI thermal management applications In terms of intrinsic thermal conductivity, diamond outperforms graphene:
Graphene has been widely adopted for conventional heat dissipation scenarios such as smartphones. However, its performance hits bottlenecks for high-end AI applications and currently only serves as an auxiliary thermal material.
Copper-diamond composite represents a relatively mature solution at present. It will occupy a unique market position in general and mid-to-high-end markets in the future.
3.What are the industrial progress and market prospects of diamond composites for AI hardware, especially in optical modules:
As optical modules evolve toward 1.6T, 3.2T and higher rates, thermal dissipation becomes critically important. Diamond-based thermal solutions will turn into a necessity.
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